Bond Fair Limited Company Information Views 24

Current Status : Dissolved

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Bond Fair Limited's Hong Kong CR Number is 1105796. Incorporation Date is 29-JAN-2007. It's Winding up Mode is . Dissolution date is 12-AUG-2011. Bond Fair Limited company is of Private company limited by shares Type.
Additional Remarks on the Bond Fair Limited company are Dissolved by Deregistration.

CRN	1105796
Company Name	BOND FAIR LIMITED
Chinese Name	邦顯有限公司
Active Status	Dissolved
Register of Charges	Unavailable
Type	Private company limited by shares See other companies with same Type - Private company limited by shares
Winding Up Mode
Date of Incorporation	29-JAN-2007 See companies with same Incorporation Date - 29-JAN-2007
Date of Dissolution	12-AUG-2011
Remarks	Dissolved by Deregistration
Important Note
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Company Name History Information :

Effective Date	Previous Name
BOND FAIR LIMITED	29-JAN-2007

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Last Updated on 23-09-2016.

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