Bond Bond Limited Company Information Views 30

Current Status : Dissolved

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Bond Bond Limited's Hong Kong CR Number is 858197. Incorporation Date is 20-AUG-2003. It's Winding up Mode is . Dissolution date is 02-DEC-2011. Bond Bond Limited company is of Private company limited by shares Type.
Additional Remarks on the Bond Bond Limited company are Dissolved by Striking Off.

CRN	858197
Company Name	BOND BOND LIMITED
Chinese Name	邦邦有限公司
Active Status	Dissolved
Register of Charges	Unavailable
Type	Private company limited by shares See other companies with same Type - Private company limited by shares
Winding Up Mode
Date of Incorporation	20-AUG-2003 See companies with same Incorporation Date - 20-AUG-2003
Date of Dissolution	02-DEC-2011
Remarks	Dissolved by Striking Off
Important Note
Tags	bond    Find Similar Companies by these tags.

Company Name History Information :

Effective Date	Previous Name
BOND BOND LIMITED	20-AUG-2003

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Last Updated on 10-07-2016.

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