Bond Technology Limited Company Information Views 16

Current Status : Dissolved

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Bond Technology Limited's Hong Kong CR Number is 503753. Incorporation Date is 24-JAN-1995. It's Winding up Mode is . Dissolution date is 19-JUN-2009. Bond Technology Limited company is of Private company limited by shares Type.
Additional Remarks on the Bond Technology Limited company are Dissolved by Striking Off.

CRN	503753
Company Name	BOND TECHNOLOGY LIMITED
Chinese Name	怡邦科技有限公司
Active Status	Dissolved
Register of Charges	Unavailable
Type	Private company limited by shares See other companies with same Type - Private company limited by shares
Winding Up Mode
Date of Incorporation	24-JAN-1995 See companies with same Incorporation Date - 24-JAN-1995
Date of Dissolution	19-JUN-2009
Remarks	Dissolved by Striking Off
Important Note
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Company Name History Information :

Effective Date	Previous Name
BOND TECHNOLOGY LIMITED	24-JAN-1995

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Last Updated on 27-08-2016.

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