J. Bond Technology Company Limited Company Information

Current Status : Live


J. Bond Technology Company Limited's Hong Kong CR Number is 972750. Incorporation Date is 25-MAY-2005. It's Winding up Mode is . Dissolution date is . J. Bond Technology Company Limited company is of Private company limited by shares Type.
Additional Remarks on the J. Bond Technology Company Limited company are .

Company Data

CRN972750
Company NameJ. Bond Technology Company Limited
Chinese Name佳邦科技有限公司
Active StatusLive
Register of ChargesUnavailable
TypePrivate company limited by shares
See other companies with same Type - Private company limited by shares
Winding Up Mode
Date of Incorporation25-MAY-2005
See companies with same Incorporation Date - 25-MAY-2005
Date of Dissolution
Remarks
Important Note
Tagstechnology   bond   
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Company Name History Information :

Effective DatePrevious Name
J. Bond Technology Company Limited25-MAY-2005

FAQs:

When was J. Bond Technology Company Limited incorporated?

J. Bond Technology Company Limited was incorporated on 25-MAY-2005 in Hongkong.

What is the type of J. Bond Technology Company Limited?

J. Bond Technology Company Limited is classified as Private company limited by shares.

What is the current status of J. Bond Technology Company Limited Company?

The status of J. Bond Technology Company Limited is Live.

What is the CR Number of J. Bond Technology Company Limited?

The CR Number of J. Bond Technology Company Limited is 972750.

* We are trying our best to keep all the data correct and up-to-date. It should be noted that it is not the primary source of the information on the company J. Bond Technology Company Limited. The official registry should always be referred for latest information.

Last Updated on 30-06-2016.

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